Ba-Pb双掺杂与晶粒细化的协同调整对BiCuSeO半导体陶瓷热电性能的影响

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摘要对BiCuSeO半导体陶瓷进行Ba/Pb双掺杂,通过机械球磨和放电等离子烧结制备Bi_1-2_xBa_xPb_xCuSeO(x=0, 0.06)半导体陶瓷材料,系统研究Ba/Pb双掺杂和球磨时间对BiCuSeO材料显微结构、热电性能和硬度的影响。结果表明,用少量Ba/Pb部分替代BiCuSeO中的Bi,可显著提高材料的电导率和功率因子,而球磨能使晶粒尺寸减小到约350 mm,从而降低材料的热导率,同时提高其电导率。球磨16 h条件下制备的Bi_0.88Ba_0.06Pb_0.06CuSeO陶瓷在873 K下具有最大功率因子,为0.76 mW/(m·K²),同时具有最大ZT值1.18,分别是未掺杂BiCuSeO陶瓷材料的2.71倍和2.19倍。

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	苏逸斯
	冯波
	胡晓明
	刘培海
	李光强
	樊希安

关键词 ：氧化物, BiCuSeO, Ba/Pb掺杂, 纳米结构工程, 热电性能

Abstract：The bulk Bi_1-2_xBa_xPb_xCuSeO (x=0, 0.06) oxide semiconductor ceramics doping Ba/Pb in BiCuSeO were prepared by mechanical alloying (MA) and spark plasma sintering (SPS). The effects of Ba/Pb doping and ball milling (BM) time on the microstructure, thermoelectric properties, and hardness were investigated systematically. The results show that partial substitution of Bi in BiCuSeO with a small amount of Ba/Pb can significantly improve the conductivity and power factor of the material, while ball milling can reduce the grain size of the material to about 350 mm, thus reducing the thermal conductivity of the material and improving its electrical conductivity. The maximum power factor of Bi_0.88Ba_0.06Pb_0.06CuSeO ceramics prepared by ball milling for 16 h is 0.76 mW/(m∙K²) at 873 K, and the maximum ZT value is 1.18, which is 2.71 times and 2.19 times higher than that of undoped BiCuSeO ceramics, respectively.

Key words： BiCuSeO Ba/Pb doping nanostructure engineering thermoelectric

收稿日期: 2018-12-06 出版日期: 2019-07-11

ZTFLH:

TG15

基金资助:国家自然科学基金资助项目(51674181,11074195); 湖北省教育厅重点项目(D2015103)

通讯作者: 樊希安,教授。电话：13628661586;E-mail: groupfxa@163.com

引用本文:

苏逸斯, 冯波, 胡晓明, 刘培海, 李光强, 樊希安. Ba-Pb双掺杂与晶粒细化的协同调整对BiCuSeO半导体陶瓷热电性能的影响[J]. 粉末冶金材料科学与工程, 2019, 24(3): 239-247.
SU Yisi, FENG Bo, HU Xiaoming, LIU Peihai, LI Guangqiang, FAN Xi’an. Effect of synergistic adjustment of Ba-Pb doping and grain refinement on thermoelectric property of BiCuSeO semiconductor ceramics. Materials Science and Engineering of Powder Metallurgy, 2019, 24(3): 239-247.

链接本文:

http://pmbjb.csu.edu.cn/CN/ 或 http://pmbjb.csu.edu.cn/CN/Y2019/V24/I3/239

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