Abstract：In order to obtain polyimide (PI) adhesives with stable properties, 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA), 2,2'-bis[4-(4-Aminophenoxy)phenyl]propane (BAPP) and 4,4'-diaminodiphenylmethane (MDA) ternary monomers were co-condensed into polyimide based on the addition of triethylamine (TEA) synthesize the precursor of polyamic acid salt (PAAS) and modify it with organic sericite to obtain PI/sericite composite adhesive. The adhesive was analyzed by DSC, and the bond strength and dynamic mechanical properties were also tested. The results show that compared with pure PI adhesive, the storage stability, thermal stability, bonding strength and damping performance of PI/sericite composite adhesive are significantly improved. During DSC analysis, the temperature at (T5) 5% mass loss and the temperature at (T10) 10% mass loss of composite binder (mass fraction of sericite is 30%) are 25 ℃ and 21 ℃ higher than those of PI binder, respectively, and the bonding strength is up to 20.0 MPa, 29.7% higher than that of pure PI binder.
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2021, Vol. 26 
