Abstract：Two pure Cu plates were bonded using (Au-20Sn)-xAg(x=0.5, 1, 2) as solder. The effects of reflow number and Ag content on the microstructure and shear strength of (Au-20Sn)-Ag/Cu solder joint were studied. The results show that IMC (intermetallic compound) in the joint line is composed of (Au,Ag,Cu)5Sn after one reflow. The CuAu layer appears after 50 reflows. Lastly, Cu3Au layer appears beside the Cu substrate after 100 reflows. The addition of Ag can suppress the growth speed of the IMC. When reflow number is one, the shear strength of solder joint increases with increasing Ag content. The shear strength of (Au-20Sn)-xAg/Cu (x=0, 0.5, 1, 2) are 92.14, 93.59 and 98.43 MPa, respectively. The shear strength decreases with increasing reflow number, and the decreasing rate decreases with increasing Ag content.
刘文胜, 陈柏杉, 马运柱, 唐思危, 黄宇峰. 回流次数和Ag含量对(Au-20Sn)-xAg/Cu焊接界面组织与剪切强度的影响[J]. 粉末冶金材料科学与工程, 2018, 23(3): 318-327.
LIU Wensheng, CHEN Baishan, MA Yunzhu, TANG Siwei, HUANG Yufeng. Effects of reflow number and Ag content on microstructure and shear strength of (Au-20Sn)-xAg/Cu joints. Materials Science and Engineering of Powder Metallurgy, 2018, 23(3): 318-327.
[1] 刘泽光, 陈登权, 罗锡明, 等. 微电子封装用金锡合金钎料[J]. 贵金属, 2005, 26(1): 62-65. LIU Zeguang, CHEN Dengquan, LUO Ximing, et al.Gold-Tin alloy solder for the package of microelectronics[J]. Precious Metals, 2005, 26(1): 62-65. [2] LEE K A, JIN Y M, SOHN Y H, et al.Continuous strip casting, microstructure and properties of Au-Sn soldering alloy[J]. Metals & Materials International, 2011, 17(1): 7-14. [3] YOON J W, CHUN H S, JUNG S B.Liquid-state and solid-state interfacial reactions of fluxless-bonded Au-20Sn/ENIG solder joint[J]. Journal of Alloys & Compounds, 2009, 469(1): 108-115. [4] 周涛, 汤姆·鲍勃, 马丁·奥德, 等. 金锡焊料及其在电子器件封装领域中的应用[J]. 电子与封装, 2005, 5(8): 5-8. ZHOU TAO, BOBAL T, OUD M, et al.An introduction to eutectic Au/Sn solder alloy and its preforms in microelectronics/ optoelectronic packaging applications[J]. Electronics & Packaging, 2005, 5(8): 5-8. [5] GOODMAN P.Current and future uses of gold in electronics[J]. Gold Bulletin, 2002, 35(1): 21-26. [6] 罗雁波, 谢宏潮, 李敏. 金锡合金钎料研究现状[J]. 有色金属, 2002, 54(7): 23-26. LUO Yanbo, XIE Hongchao, LI Min.Preparation of Au-Sn alloy for solder filler metal[J]. Nonferrous Metals, 2002, 54(7): 23-26. [7] ZSCHECH, EHEWNFRIED.Materials for information technology[M]. Springer, 2005, 101(2): 149-154. [8] CHUNG H M, CHEN C M, LIN C P, et al.Microstructural evolution of the Au-20wt.% Sn solder on the Cu substrate during reflow[J]. Journal of Alloys & Compounds, 2009, 485(1): 219-224. [9] TSAI J Y, CHANG C W, SHIEH Y C, et al.Controlling the microstructure from the gold-tin reaction[J]. Journal of Electronic Materials, 2005, 34(2): 182-187. [10] ZHANG G S, JING H Y, XU L Y, et al.Creep behavior of eutectic 80Au/20Sn solder alloy[J]. Journal of Alloys & Compounds, 2009, 476(1): 138-141. [11] OSAMU W, AKIKO Y. Low melting point Au-Sn brazing filler metal: JP, 05177380[P].1993-07-20. [12] CHIDAMBARAM V, HALD J, HATTEL J.Development of gold based solder candidates for flip chip assembly[J]. Microelectronics Reliability, 2009, 49(3): 323-330. [13] 张海坡, 阮建明. 电子封装材料及其技术发展状况[J]. 粉末冶金材料科学与工程, 2003, 8(3): 216-223. ZHANG H, RUAN J.The development of materials and technology of electronic packaging[J]. Materials Science and Engineering of Powder Metallurgy, 2003, 8(3): 216-223. [14] 韩媛媛, 郭宏. 数值模拟在大功率LED封装热分析中的应用现状[J]. 材料导报, 2010, 24(11): 108-124. HAN Yuanyuan, GUO Hong.Application of numerical simulation in thermal analysis of high power LEDs package[J]. Materials Review, 2010, 24(11): 108-124. [15] TEW J W R, SHI X Q, YUAN S. Au/Sn solder for face-down bonding of AlGaAs/GaAs ride waveguide laser diodes[J]. Material Letters, 2004, 58(21): 2695-2699. [16] TSAI J Y, CHANG C W, HO C E, et al.Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates[J]. Journal of Electronic Materials, 2006, 35(1): 65-71.
2018, Vol. 23 
