电共沉积法制备铜铁合金及其表征

doi:10.19976/j.cnki.43-1448/TF.2024014

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摘要铜铁合金具有优异的导电、导热性能以及独特的电磁屏蔽性能,且成本低廉,应用广泛,但易发生成分偏析。为解决这一问题,以五水合硫酸铜和七水合硫酸亚铁为原料,采用电共沉积法制备Cu-Fe合金镀层,通过扫描电子显微镜、能谱仪和透射电镜对镀层进行表征,研究电流密度、主盐离子浓度、络合剂浓度对镀层成分和显微组织的影响,探究镀层的生长过程。结果表明：Fe²⁺、Cu²⁺和柠檬酸(络合剂)浓度分别为0.016、0.04和0.2 mol/L,电流密度为2.0 A/dm²时,Cu-Fe合金镀层光亮平整无裂纹,具有较高的Fe含量(w(Fe)=14.87%)。镀层中Cu和Fe分布均匀,不存在单独的Fe相,证明电沉积过程中形成了亚稳合金。镀层中广泛分布着纳米晶,晶粒尺寸在20~100 nm之间。Cu-Fe镀层由细小枝晶密集生长,而后分化为小颗粒紧密生长,随时间延长颗粒逐渐长大,出现显著优先生长,颗粒之间可见明显间隙。不均匀的电场和成核位置分布是导致枝晶无序生长的主要原因。

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	常帅卿
	甘雪萍
	刘超强

关键词 ：铜铁合金, 电共沉积, 纳米晶, 微观结构, 固溶体

Abstract：Cu-Fe alloys have excellent electrical and thermal conductivity and unique electromagnetic shielding property, low cost and wide application, but is prone to component segregation. In order to solve the problem, Cu-Fe alloy coatings were prepared by electric co-deposition with CuSO₄∙5H₂O and FeSO₄∙7H₂O as raw materials. The coatings were characterized by scanning electron microscopy, energy dispersive spectrometer, and transmission electron microscopy. The effects of current density, main salt ion concentration, and complexing agent concentration on the content and microstructure of the coatings were studied, and the growth process of the coating was explored. The results show that when the concentrations of Fe²⁺, Cu²⁺, and citric acid (complexing agent) are 0.016, 0.04, and 0.2 mol/L, respectively, current density is 2.0 A/dm², the Cu-Fe alloy coating is bright and smooth without cracks, and has a high Fe content (w(Fe)=14.87%). The distribution of Cu and Fe in the coating is uniform, and there is no single Fe phase, which proves that metastable alloy is formed during electric co-deposition. Nanocrystals are widely distributed in the coating, with grain sizes ranging from 20 nm to 100 nm. Cu-Fe coating grows densely from small dendrites, and then differentiate into small particles. The particles grow gradually with the extension of time, and there is significant preferential growth and obvious gap between particles. The non-uniform electric field and nucleation position distribution are the main reasons leading to the disordered growth of dendrites.

Key words： Cu-Fe alloy electric co-deposition nanocrystalline microstructure solid solution

收稿日期: 2024-02-29 出版日期: 2024-05-31

ZTFLH:

TB333

基金资助:国家自然科学基金资助项目(52071342)

通讯作者: 甘雪萍,教授,博士。电话：13607437973;E-mail: ganxueping@csu.edu.cn

引用本文:

常帅卿, 甘雪萍, 刘超强. 电共沉积法制备铜铁合金及其表征[J]. 粉末冶金材料科学与工程, 2024, 29(2): 139-150.
CHANG Shuaiqing, GAN Xueping, LIU Chaoqiang. Preparation and characterization of Cu-Fe alloy by electric co-deposition. Materials Science and Engineering of Powder Metallurgy, 2024, 29(2): 139-150.

链接本文:

http://pmbjb.csu.edu.cn/CN/10.19976/j.cnki.43-1448/TF.2024014 或 http://pmbjb.csu.edu.cn/CN/Y2024/V29/I2/139

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