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粉末冶金材料科学与工程  2022, Vol. 27 Issue (4): 389-397    DOI: 10.19976/j.cnki.43-1448/TF.2022010
  工艺技术 本期目录 | 过刊浏览 | 高级检索 |
致密化温度及界面类型对SiCf/SiC Mini复合材料结构与力学性能的影响
王铎1, 陈招科1, 何宗倍2, 张瑞谦2, 熊翔1
1.中南大学 轻质高强结构材料国家级重点实验室,长沙 410083;
2.中国核动力研究设计院 反应堆燃料及材料重点实验室,成都 610213
Influence of densification temperature and interface type on the structure and mechanical properties of SiCf/SiC Mini composites
WANG Duo1, CHEN Zhaoke1, HE Zongbei2, ZHANG Ruiqian2, XIONG Xiang1
1. Science and Technology on High Strength Materials Laboratory, Central South University, Changsha 410083, China;
2. Science and Technology on Reactor Fuel and Materials Laboratory,Nuclear Power Institute of China, Chengdu 610213, China
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摘要 利用化学气相渗透(chemical vapour infiltration, CVI)在SiC纤维束中引入PyC(pyrolytic carbon, 热解碳)界面和(PyC/SiC)3多层界面,并分别在1 050 ℃和1 250 ℃下对含PyC界面SiC纤维束、1 050 ℃下对含(PyC/SiC)3多层界面纤维束进行SiC基体增密,制备出不同界面类型和基体结构的SiCf/SiC(continuous SiC fiber reinforced SiC matrix) Mini复合材料。研究界面类型和基体致密化温度对SiCf/SiC Mini复合材料微观结构和拉伸断裂行为的影响。结果表明,SiCf/SiC Mini复合材料内部纤维和基体间的界面清晰,界面厚度约300 nm。1 050 ℃致密化的PyC界面SiCf/SiC Mini复合材料的抗拉强度为174 MPa,脱黏主要发生在基体与界面之间。而(PyC/SiC)3多层界面SiCf/SiC Mini复合材料抗拉强度达到540 MPa,脱黏主要发生在亚层与亚层之间。PyC界面SiCf/SiC Mini复合材料随基体致密化温度升高,SiC基体从细小多孔的针状转变为粗大致密的层片状,晶粒尺寸和结晶度显著提高。1 250 ℃致密化的复合材料的抗拉强度为309 MPa,呈典型的脆性断裂特征。
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王铎
陈招科
何宗倍
张瑞谦
熊翔
关键词 SiCf/SiC Mini复合材料化学气相渗透界面致密化温度抗拉强度    
Abstract:Pyrolytic carbon (PyC) interface and (PyC/SiC)3 multi-layer interfaces were introduced into SiC fiber bundles by chemical vapour infiltration (CVI). After densification of SiC matrix in SiC fiber bundles containing PyC interface at 1 050 ℃ and 1 250 ℃, and in SiC fiber bundles containing (PyC/SiC)3 multilayer interface at 1 050 ℃, SiCf/SiC Mini composites with different interface types and different matrix structures were obtained. The microstructure and tensile fracture behavior of the as-prepared SiCf/SiC minicomposites were studied. The results show that a clear interface with the thickness of about 300 nm is introduced successfully between the inner fiber and the SiC matrix. After densification at 1 050 ℃, the tensile strength of the SiCf/SiC Mini composite with PyC interface is 174 MPa, with the debonding mainly occurring between the SiC matrix and the interface. While the tensile strength of SiCf/SiC Mini composites with (PyC/SiC)3 multilayer interface reaches 540 MPa, with the debonding mainly occurring between the sublayer of the multilayer. As the densification temperature increases, the SiC matrix of the SiCf/SiC Mini composites changes from fine, porous needle-like to coarse, dense lamellar, with the grain size and crystallinity increaseing significantly. The tensile strength of the composites obtained at 1 250 ℃ is 309 MPa, showing typical brittle fracture characteristics.
Key wordsSiCf/SiC Mini composites    chemical vapour infiltration    interface    densification temperature    tensile strength
收稿日期: 2022-02-14      出版日期: 2022-09-14
ZTFLH:  TB332  
基金资助:国家自然科学基金资助项目(52072410)
通讯作者: 陈招科,研究员,博士。电话:13987015470;E-mail: chenzhaoke2008@csu.edu.cn   
引用本文:   
王铎, 陈招科, 何宗倍, 张瑞谦, 熊翔. 致密化温度及界面类型对SiCf/SiC Mini复合材料结构与力学性能的影响[J]. 粉末冶金材料科学与工程, 2022, 27(4): 389-397.
WANG Duo, CHEN Zhaoke, HE Zongbei, ZHANG Ruiqian, XIONG Xiang. Influence of densification temperature and interface type on the structure and mechanical properties of SiCf/SiC Mini composites. Materials Science and Engineering of Powder Metallurgy, 2022, 27(4): 389-397.
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http://pmbjb.csu.edu.cn/CN/10.19976/j.cnki.43-1448/TF.2022010     或     http://pmbjb.csu.edu.cn/CN/Y2022/V27/I4/389
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