Cu/Ag掺杂TiO<sub>2</sub>包覆SiO<sub>2</sub>纳米复合材料的结构与光催化性能

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摘要采用溶胶-凝胶法制备包覆层厚度约为12 nm的高分散性TiO₂包覆SiO₂(TCS)复合粉末。在此基础上,合成光催化效率显著提高的Cu和Ag掺杂TCS光催化剂。利用X射线衍射仪、X射线光电子能谱仪、紫外-可见分光光度计和光催化降解甲基橙测试等,系统研究包覆和掺杂对TiO₂结构及光催化活性的影响规律和相关作用机制。结果表明,TiO₂与SiO₂的界面可能以Ti—O—Si化学键联结,并通过影响TiO₂的结晶过程而抑制TiO₂晶粒的长大。通过控制实验条件得到了性能优异的Cu₂O-TiO₂-SiO₂复合粉末,Cu掺杂的作用机制可理解为Cu₂O半导体对TiO₂的修饰,光催化活性的提高与氧空位和Cu₂O有关。相比较,Ag掺杂对TiO₂的禁带宽度影响不大,但吸光强度有较大提高。当Ag掺杂量为1.0%时,光催化降解甲基橙效率达到95.7%。

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	官仁发
	肖亚
	刘启明
	刘绍军

关键词 ：二氧化钛, 二氧化硅, 氧化亚铜, 银, 掺杂, 光催化

Abstract：The TiO₂-coated SiO₂ (TCS) nanocatalysts with about 12 nm thickness coating and high dipersity were synthesized by the sol-gel method. Based on the previous experiment, the photocatalytic efficiency of TCS catalysts was enhanced notably by doping Cu and Ag. The effects of coating and doping on the structure and photocatalytic activity of TiO₂ and the relative mechanism were investigated by XRD, XPS, UV-vis and the photocatalytic degradation experiment of methyl orange. The results show that, the Ti—O—Si bonds between the interface of TiO₂ and SiO₂ have an impact on the crystallization process of TiO₂ and restrain the growth of the grains. Cu₂O-TiO₂-SiO₂ composite powder with excellent performance can be synthesized by controlling the experimental conditions. The reinforcement mechanism of doping Cu can be ascribed to the modification of Cu₂O semiconductor to TiO₂. The increasing of photocatalytic property is related to the oxygen vacancy and Cu₂O particles. Doping Ag cannot change the width of the forbidden band but can improve the intensity of light absorption, and the photocatalytic degradation efficiency is 95.7% after doping 1.0%Ag.

Key words： TiO₂ SiO₂ Cu₂O Ag doping photocatalytic

收稿日期: 2017-04-07 出版日期: 2019-07-11

ZTFLH:

TM23

基金资助:国家科学自然基金资助项目(21641013)

通讯作者: 刘绍军,研究员,博士。电话：13974953502：E-mail: liumatthew@csu.edu.cn

引用本文:

官仁发, 肖亚, 刘启明, 刘绍军. Cu/Ag掺杂TiO₂包覆SiO₂纳米复合材料的结构与光催化性能[J]. 粉末冶金材料科学与工程, 2018, 23(1): 101-109.
GUAN Renfa, XIAO Ya, LIU Qiming, LIU Shaojun. Synthesis and photocatalytic property of SiO₂ nanopowder coated by Cu/Ag-doped TiO₂. Materials Science and Engineering of Powder Metallurgy, 2018, 23(1): 101-109.

链接本文:

http://pmbjb.csu.edu.cn/CN/ 或 http://pmbjb.csu.edu.cn/CN/Y2018/V23/I1/101

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