基于JMatPro的Sn-In-Ag/Bi系低温无铅钎料成分性能设计

doi:10.19976/j.cnki.43-1448/TF.2021076

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摘要针对Sn-In系低温无铅钎料存在生产成本高、力学性能偏低的问题,基于Sn-In合金相图选择低熔点的Sn-In系钎料合金,进行组分优化来改善热物性能、力学性能、降低成本的研究。在保持Sn75不变的情况下,通过添加Ag和Bi元素,形成不同组分比例的Sn-In-Ag/Bi的低温无铅钎料。采用材料相图与热力学模拟软件JMatPro中的锡合金模块对低温钎料组分进行模拟计算,获得不同组分的无铅钎料的相组成、热物性能和力学性能。同时,研究温度和合金含量对熔点、熔化区间、热物性能和力学性能的影响规律。模拟结果表明,Sn-In-Ag和Sn-In-Ag-Bi系两类低温无铅钎料的优化组分分别为Sn75Ag3In22和Sn75In17Ag3Bi5。

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	焦华
	白嘉瑜
	张建勋
	赵康

关键词 ： Sn-In, 无铅钎料, JMatPro, 相图, 热物性能

Abstract：In order to solve the problems of high production cost and low mechanical properties of Sn-In lead-free solder, the low melting point Sn-In solder alloy was selected due to the phase diagram of Sn-In alloy. The composition optimization of Sn-In solder alloy was carried out to improve the thermal properties, mechanical properties and reduce cost. The low temperature lead free solder of Sn-In-Ag/Bi with different composition ratios can be formed by adding Ag and Bi elements at Sn75. The low temperature solder composition was simulated and calculated by the material phase diagram and thermodynamic simulation software of JMatPro. The Sn alloy module was selected in the software. The phase composition, thermal properties, and mechanical properties of the lead-free solder with different composition changes can be obtained. Meanwhile, the effects of temperature and alloy content on melting point, melting range, thermal properties and mechanical properties were studied. The simulation results show that two types of low-temperature lead-free solders of Sn-In-Ag and Sn-In-Ag-Bi series have the optimized compositions of Sn75Ag3In22 and Sn75In17Ag3Bi5, respectively.

Key words： Sn-In lead-free solder JMatPro phase diagram thermphysical property

收稿日期: 2021-08-26 出版日期: 2022-07-19

ZTFLH:

TG146.14

基金资助:国家自然科学基金资助项目(51875442); 陕西省自然科学基金资助项目(2020JQ-626)

通讯作者: 张建勋,教授,博士。电话：029-82668807;E-mail: jxzhang@mail.xjtu.edu.cn; 赵康,教授,博士。电话：029-82312791;E-mail:kzhao@xaut.edu.cn

引用本文:

焦华, 白嘉瑜, 张建勋, 赵康. 基于JMatPro的Sn-In-Ag/Bi系低温无铅钎料成分性能设计[J]. 粉末冶金材料科学与工程, 2022, 27(3): 267-275.
JIAO Hua, BAI Jiayu, ZHANG Jianxun, ZHAO Kang. Composition performance design of Sn-In-Ag/Bi series low-temperature lead-free solder based on Jmatpro software. Materials Science and Engineering of Powder Metallurgy, 2022, 27(3): 267-275.

链接本文:

http://pmbjb.csu.edu.cn/CN/10.19976/j.cnki.43-1448/TF.2021076 或 http://pmbjb.csu.edu.cn/CN/Y2022/V27/I3/267

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