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Materials Science and Engineering of Powder Metallurgy  2022, Vol. 27 Issue (4): 389-397    DOI: 10.19976/j.cnki.43-1448/TF.2022010
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Influence of densification temperature and interface type on the structure and mechanical properties of SiCf/SiC Mini composites
WANG Duo1, CHEN Zhaoke1, HE Zongbei2, ZHANG Ruiqian2, XIONG Xiang1
1. Science and Technology on High Strength Materials Laboratory, Central South University, Changsha 410083, China;
2. Science and Technology on Reactor Fuel and Materials Laboratory,Nuclear Power Institute of China, Chengdu 610213, China
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Abstract  Pyrolytic carbon (PyC) interface and (PyC/SiC)3 multi-layer interfaces were introduced into SiC fiber bundles by chemical vapour infiltration (CVI). After densification of SiC matrix in SiC fiber bundles containing PyC interface at 1 050 ℃ and 1 250 ℃, and in SiC fiber bundles containing (PyC/SiC)3 multilayer interface at 1 050 ℃, SiCf/SiC Mini composites with different interface types and different matrix structures were obtained. The microstructure and tensile fracture behavior of the as-prepared SiCf/SiC minicomposites were studied. The results show that a clear interface with the thickness of about 300 nm is introduced successfully between the inner fiber and the SiC matrix. After densification at 1 050 ℃, the tensile strength of the SiCf/SiC Mini composite with PyC interface is 174 MPa, with the debonding mainly occurring between the SiC matrix and the interface. While the tensile strength of SiCf/SiC Mini composites with (PyC/SiC)3 multilayer interface reaches 540 MPa, with the debonding mainly occurring between the sublayer of the multilayer. As the densification temperature increases, the SiC matrix of the SiCf/SiC Mini composites changes from fine, porous needle-like to coarse, dense lamellar, with the grain size and crystallinity increaseing significantly. The tensile strength of the composites obtained at 1 250 ℃ is 309 MPa, showing typical brittle fracture characteristics.
Key wordsSiCf/SiC Mini composites      chemical vapour infiltration      interface      densification temperature      tensile strength     
Received: 14 February 2022      Published: 14 September 2022
ZTFLH:  TB332  
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WANG Duo
CHEN Zhaoke
HE Zongbei
ZHANG Ruiqian
XIONG Xiang
Cite this article:   
WANG Duo,CHEN Zhaoke,HE Zongbei, et al. Influence of densification temperature and interface type on the structure and mechanical properties of SiCf/SiC Mini composites[J]. Materials Science and Engineering of Powder Metallurgy, 2022, 27(4): 389-397.
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http://pmbjb.csu.edu.cn/EN/10.19976/j.cnki.43-1448/TF.2022010     OR     http://pmbjb.csu.edu.cn/EN/Y2022/V27/I4/389
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