回流次数和Ag含量对(Au-20Sn)-<em>x</em>Ag/Cu焊接界面组织与剪切强度的影响

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Abstract Two pure Cu plates were bonded using (Au-20Sn)-xAg(x=0.5, 1, 2) as solder. The effects of reflow number and Ag content on the microstructure and shear strength of (Au-20Sn)-Ag/Cu solder joint were studied. The results show that IMC (intermetallic compound) in the joint line is composed of (Au,Ag,Cu)₅Sn after one reflow. The CuAu layer appears after 50 reflows. Lastly, Cu₃Au layer appears beside the Cu substrate after 100 reflows. The addition of Ag can suppress the growth speed of the IMC. When reflow number is one, the shear strength of solder joint increases with increasing Ag content. The shear strength of (Au-20Sn)-xAg/Cu (x=0, 0.5, 1, 2) are 92.14, 93.59 and 98.43 MPa, respectively. The shear strength decreases with increasing reflow number, and the decreasing rate decreases with increasing Ag content.

Key words： (Au-20Sn)-xAg solder microstructure multiple reflows Ag content shear strength

Received: 26 April 2017 Published: 12 July 2019

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	LIU Wensheng
	CHEN Baishan
	MA Yunzhu
	TANG Siwei
	HUANG Yufeng

Cite this article:

LIU Wensheng,CHEN Baishan,MA Yunzhu, et al. Effects of reflow number and Ag content on microstructure and shear strength of (Au-20Sn)-xAg/Cu joints[J]. Materials Science and Engineering of Powder Metallurgy, 2018, 23(3): 318-327.

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http://pmbjb.csu.edu.cn/EN/ OR http://pmbjb.csu.edu.cn/EN/Y2018/V23/I3/318

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