模塑法一体成形电感过程的数值模拟

doi:10.19976/j.cnki.43-1448/TF.2022065

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Abstract When the traditional molding method is used to prepare the integrated forming inductance, the forming pressure is large, and the formed inductance is prone to short circuit, sudden change of insulation impedance, coating cracking and peeling. In this paper, a new inductance molding method, liquid composites molding, was proposed. The whole process of inductive molding was simulated and analyzed by finite element software. The effects of mold temperature and filling time on the curing degree, as well as the effects of filling speed on the filling time and pore size were studied, so as to obtain the optimized forming process parameters. Then, an inductance molding experiment is conducted to test the inductance value (L), direct current resistance (DCR) and full load resistance (FLL). The results show that the curing degree increases with the increase of mold temperature or curing time. With the increase of filling speed, the filling time is shortened, and the number and size of pores first decrease and then increase. The optimum process parameters are mold temperature 175 ℃, filling speed 3 mm/s and curing time 150s. The inductance (FeSiAl/epoxy resin) has an average inductive value of 46.58 μH. The DCR is 116 mΩ, and the inductive value drop rate is 33.25% under 2.6 A for 30 min. The key indicators of the inductance are better than those of inductance prepared by traditional molding process. It proves that the liquid

Received: 27 June 2022 Published: 23 March 2023

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	Articles by authors
	WANG Hao
	GUO Feng
	FU Bangliang
	YAN Liangming

Cite this article:

WANG Hao,GUO Feng,FU Bangliang, et al. Numerical simulation of integrated inductor process by liquid composites molding[J]. Materials Science and Engineering of Powder Metallurgy, 2023, 28(1): 1-8.

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http://pmbjb.csu.edu.cn/EN/10.19976/j.cnki.43-1448/TF.2022065 OR http://pmbjb.csu.edu.cn/EN/Y2023/V28/I1/1

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