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Effect of reducing agent concentration on the growth of Sn-Ag nanoparticles synthesized by chemical co-reduction method |
WANG Yao, MA Yunzhu, LIU Wensheng, TANG Siwei, HUANG Yufeng |
State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, China |
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Abstract Sn-3.5%Ag (mass fraction, %) nanoparticles were synthesized by chemical co-reduction method and the morphology, phase composition and thermal behavior were studied. The effects of reducing agent concentration on nanoparticles size and the mechanism of nucleation and growth in the solution were studied. The results show that the concentration of reducing agent controls the rate of particle nucleation and growth in the solution, and the average particle size decreases with increasing the reducing agent concentration. The average radius of the nanoparticles reaches a minimum value of about 13nm when the reducing agent concentration is 0.25 mol/L. The nanoparticles consist of β-Sn and Ag3Sn phases. The minimum melting point is about 206 ℃. The increasing concentration of the reducing agent consumes a large amount of metal ions for instantaneous nucleation and inhibits further growth of the nanoparticles. Ag3Sn nucleates and grows in the solution preferentially. With the decrease of Ag atoms saturation in the solution, the composition of the nanoparticles is dominated by β-Sn. Finally forms nano-alloy consisting of Ag3Sn and β-Sn phases.
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Received: 26 March 2018
Published: 19 July 2019
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[1] 朱奇农. 电子封装中表面贴装焊点的可靠性研究[D]. 上海:中国科学院上海冶金研究所, 2000. ZHU Qinong.Reliability of surface mount solder joints in electronic packaging[D]. Shanghai: Chinese Academy of Sciences Shanghai Metallurgical Institute, 2000. [2] 李操. 3D封装工艺及可靠性研究[D]. 武汉: 华中科技大学, 2015. LI Cao.3D packaging process and reliability study[D]. Wuhan: Huazhong University of Science and Technology, 2015. [3] ZHANG H, TANG W M, XU G Q, et al.Synthesis of Sn-Ag binary alloy powders by mechanical alloying[J]. Materials Chemistry and Physics, 2010, 122(1): 64-68. [4] QI W H, HUANG B Y, WANG M P.Size and shape-dependent formation enthalpy of binary alloy nanoparticles[J]. Physical B: Condensed Matter, 2009, 404(12/13): 1761-1765. [5] 杨明, 韩蓓蓓, 马鑫, 等. 纳米无铅焊料的研究进展[J]. 电子工艺技术, 2014, 1(35): 1-5. YANG Ming, HAN Beibei, MA Xin, et al.Current status of nanolead-free solder alloys[J]. Electronics Process Technology, 2014, 1(35): 1-5. [6] CHEE S S, CHOI E B, LEE J H.Fabrication of Sn-3.5Ag eutectic alloy powder by annealing sub-micrometer Sn-Ag powder prepared by citric acid-assisted Ag immersion plating[J]. Journal of Nanoscience and Nanotechnology, 2015, 15(11): 8407-8413. [7] KUMAR A, OJHA D P.Theoretical study of size dependent properties of CdSe quantum dots[J]. Indian Journal of Physics, 2016, 90(9): 1041-1047. [8] GILROY K D, RUDITSKIY A, PENG H C, et al.Bimetallic nanocrystals: Syntheses, properties, and applications[J]. Chemical Reviews, 2016, 116(18): 10414-10472. [9] WANG Y, LEE J Y, DEIVARAJ T C.Controlled Synthesis of V-shaped SnO2 Nanorods[J]. The Journal of Physical Chemistry B, 2004, 108(36): 13589-13593. [10] ABEBE A, HAILEMARIAM T.Synthesis and assessment of antibacterial activities of ruthenium (III) Mixed ligand complexes containing 1,10-phenanthroline and guanine[J]. Bioinorganic Chemistry and Applications, 2016: 1-9. [11] WRONSKI C R M. The size dependence of the melting point of small particles of tin[J]. British Journal of Applied Physics, 1967, 18(12): 1731-1737. [12] HASHIMOTO R, SHIBUTA Y, SUZUKI T.Estimation of solid-liquid interfacial energy from gibbs-thomson effect: a molecular dynamics study[J]. ISIJ International, 2011, 51(10): 1664-1667. [13] GAO Y, ZOU C, YANG B, et al.Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy[J]. Journal of Alloys and Compounds, 2009, 484(/2): 777-781. [14] ZHANG W, ZHAO B, ZOU C, et al.Investigating the formation process of Sn-based lead-free nanoparticles with a chemical reduction method[J]. Journal of Nanomaterials, 2013: 1-9. [15] WANG C, YIN H, CHAN R, et al.One-Pot synthesis of oleylamine coated AuAg alloy NPs and their catalysis for CO oxidation[J]. Chemistry of Materials, 2009, 21(3): 433-435. [16] ROSHANGHIAS A, YAKYMOVYCH A, BERNARDI J, et al.Synthesis and thermal behavior of tin-based alloy (Sn-Ag-Cu) nanoparticles[J]. Nanoscale, Royal Society of Chemistry, 2015, 7: 5843-5851. [17] FISENKO S P, ROSTAMI A A, Kane D B, et al.Modeling of formation and growth of nanodroplets at high nucleation rate[C]// BORISENKO V E, GAPONENKO S V, GURIN V S, et al. Physics, Chemistry and Application of Nanostructures: Reviews and Short Notes to Nanomeeting-2017. Minsk, Belarus: World Scientific, 2017: 422-424. [18] LIU H, CAO G.Effectiveness of the Young-Laplace equation at nanoscale[J]. Scientific Reports, 2016, 6(1): 23936. [19] YUNG K C, LAW C M T, LEE C P, et al. Size control and characterization of Sn-Ag-Cu lead-free nanosolders by a chemical reduction process[J]. Journal of Electronic Materials, 2012, 41(2): 313-321. |
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