针对电子封装用基板材料热导率低、热膨胀系数高的问题,本文采用冰模板法制备层状多孔TiC-Ni支架,并结合真空浸渍法将环氧树脂(epoxy, EP)渗入多孔支架的孔隙中,制备层状TiC-Ni/EP复合材料。采用扫描电子显微镜、万能力学试验机和热膨胀仪等设备,研究Ni含量对层状多孔TiC-Ni支架的孔隙形貌、层状结构特征以及复合材料的微观结构、力学性能、热学性能的影响规律。结果表明：随Ni含量增加,多孔支架的层间距和层壁厚度增大,复合材料的抗压强度和抗弯强度降低,热导率和热膨胀系数增大。φ(Ni)=2%时,多孔支架和复合材料均获得最佳的层状结构特征,复合材料的热导率为2.24 W/(m·K),热膨胀系数为30.23×10-6 K-1。
To address the problem that low thermal conductivity and high thermal expansion coefficient of substrate materials for electronic packaging, the layered porous TiC-Ni frameworks were prepared by ice template method, and then layered TiC-Ni/EP composites were prepared through infiltrating epoxy (EP) into the pores of porous frameworks via vacuum impregnation method in this paper. Scanning electron microscope, universal mechanical testing machine, and thermodilatometer were used to study the effects of Ni content on the pore morphology, laminar structure characteristics of the layered porous TiC-Ni frameworks and the microstructure, mechanical, and thermal properties of the composites. The results show that the interlayer spacing and wall thickness of porous frameworks increase, the compressive strength and bending strength of the composites decrease with the increase of Ni content, while the thermal conductivity and thermal expansion coefficient of composites increase. The porous frameworks and the composite with φ(Ni)=2% have the best laminar structure characteristics, the thermal conductivity of the composite is 2.24 W/(m·K), and the thermal expansion coefficient is 30.23×10-6 K-1.
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