以石墨烯和SiC粉末(SiC powder, SiCp)为填料,聚碳硅烷(polycarbosilane, PCS)为陶瓷前驱体,制备石墨烯/SiCp/PCS浆料,通过直写3D打印和高温热解得到多孔结构的轻质导电石墨烯/SiC基复合材料。研究浆料成分和打印工艺对3D打印成形性的影响,并表征复合材料的结构和性能。结果表明：通过控制固相含量、石墨烯/SiCp复合粉末中的石墨烯含量和分散剂含量,使浆料黏度在32.0 Pa·s左右时,挤出丝成形性良好;打印速度为360 mm/min、打印层高为0.48 mm时,点阵网格结构的3D打印成形性最佳;打印素坯在1 100 ℃保温2 h后,PCS热解为陶瓷。多孔复合材料的平均抗压强度和电导率分别为11 MPa和8 S/m。本研究为多孔石墨烯/SiC基复合材料的制备提供了一条新路径。
Graphene/SiCp/PCS slurry was prepared using graphene and SiC powder (SiCp) as fillers and polycarbosilane (PCS) as ceramic precursor, and then the porous lightweight conductive graphene/SiC-based composite was prepared by direct ink write 3D printing and high temperature pyrolysis method. The influences of slurry composition and printing process on 3D printing formability were investigated, and the microstructure and properties of composite were characterized. The results show that the formability of the extruded filament is suitable for printing when the slurry viscosity is about 32.0 Pa·s by controlling the solid content, graphene content in graphene/SiCp composite powder, and dispersant content. When the printing speed is 360 mm/min and the layer height is 0.48 mm, the formability of the lattic grid structure for 3D printing is optimal. After heating the printed green body at 1 100 ℃ for 2 h, PCS is pyrolyzed into ceramics, the average compressive strength and conductivity of the composite are 11 MPa and 8 S/m, respectively. This study provides a new pathway for the preparation of porous graphene/SiC-based composite.
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