采用传统模压方法一体化成形电感时,成形压力大,成形的电感易发生短路、绝缘阻抗突变、包覆层破裂剥落等问题。本文提出一种新型的电感成形方法?模塑成形,通过有限元软件对电感模塑成形的完整过程进行模拟分析,研究模具温度与固化时间对固化度的影响,以及充填速度对充填时间与气孔大小的影响,从而得到优化的成形工艺参数,然后进行电感模塑成形实验,测试电感感值(L)、直流电阻(direct current resistance, DCR)与损耗(full load inductance, FLL)。模拟结果表明：随模具温度升高或固化时间延长,固化度增大;随充填速度增大,充填时间缩短,气孔的数量和尺寸先减小后增大。模塑成形电感的最佳工艺参数为：模具温度175 ℃、充填速度3 mm/s和固化时间150 s。在该工艺参数下成形的FeSiAl/环氧树脂电感,平均感值为46.58 μH、直流电阻为116 mΩ、在2.6 A电流下通电30 min,感值下降率为33.25%,电感的关键指标都优于传统模压工艺制备的电感。表明模塑法一体化成形电感可行,为提高电感质量和生产效率提供了新途径。
When the traditional molding method is used to prepare the integrated forming inductance, the forming pressure is large, and the formed inductance is prone to short circuit, sudden change of insulation impedance, coating cracking and peeling. In this paper, a new inductance molding method, liquid composites molding, was proposed. The whole process of inductive molding was simulated and analyzed by finite element software. The effects of mold temperature and filling time on the curing degree, as well as the effects of filling speed on the filling time and pore size were studied, so as to obtain the optimized forming process parameters. Then, an inductance molding experiment is conducted to test the inductance value (L), direct current resistance (DCR) and full load resistance (FLL). The results show that the curing degree increases with the increase of mold temperature or curing time. With the increase of filling speed, the filling time is shortened, and the number and size of pores first decrease and then increase. The optimum process parameters are mold temperature 175 ℃, filling speed 3 mm/s and curing time 150s. The inductance (FeSiAl/epoxy resin) has an average inductive value of 46.58 μH. The DCR is 116 mΩ, and the inductive value drop rate is 33.25% under 2.6 A for 30 min. The key indicators of the inductance are better than those of inductance prepared by traditional molding process. It proves that the liquid
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