利用化学气相渗透(chemical vapour infiltration, CVI)在SiC纤维束中引入PyC(pyrolytic carbon, 热解碳)界面和(PyC/SiC)3多层界面,并分别在1 050 ℃和1 250 ℃下对含PyC界面SiC纤维束、1 050 ℃下对含(PyC/SiC)3多层界面纤维束进行SiC基体增密,制备出不同界面类型和基体结构的SiCf/SiC(continuous SiC fiber reinforced SiC matrix) Mini复合材料。研究界面类型和基体致密化温度对SiCf/SiC Mini复合材料微观结构和拉伸断裂行为的影响。结果表明,SiCf/SiC Mini复合材料内部纤维和基体间的界面清晰,界面厚度约300 nm。1 050 ℃致密化的PyC界面SiCf/SiC Mini复合材料的抗拉强度为174 MPa,脱黏主要发生在基体与界面之间。而(PyC/SiC)3多层界面SiCf/SiC Mini复合材料抗拉强度达到540 MPa,脱黏主要发生在亚层与亚层之间。PyC界面SiCf/SiC Mini复合材料随基体致密化温度升高,SiC基体从细小多孔的针状转变为粗大致密的层片状,晶粒尺寸和结晶度显著提高。1 250 ℃致密化的复合材料的抗拉强度为309 MPa,呈典型的脆性断裂特征。
Pyrolytic carbon (PyC) interface and (PyC/SiC)3 multi-layer interfaces were introduced into SiC fiber bundles by chemical vapour infiltration (CVI). After densification of SiC matrix in SiC fiber bundles containing PyC interface at 1 050 ℃ and 1 250 ℃, and in SiC fiber bundles containing (PyC/SiC)3 multilayer interface at 1 050 ℃, SiCf/SiC Mini composites with different interface types and different matrix structures were obtained. The microstructure and tensile fracture behavior of the as-prepared SiCf/SiC minicomposites were studied. The results show that a clear interface with the thickness of about 300 nm is introduced successfully between the inner fiber and the SiC matrix. After densification at 1 050 ℃, the tensile strength of the SiCf/SiC Mini composite with PyC interface is 174 MPa, with the debonding mainly occurring between the SiC matrix and the interface. While the tensile strength of SiCf/SiC Mini composites with (PyC/SiC)3 multilayer interface reaches 540 MPa, with the debonding mainly occurring between the sublayer of the multilayer. As the densification temperature increases, the SiC matrix of the SiCf/SiC Mini composites changes from fine, porous needle-like to coarse, dense lamellar, with the grain size and crystallinity increaseing significantly. The tensile strength of the composites obtained at 1 250 ℃ is 309 MPa, showing typical brittle fracture characteristics.
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