Ni/Bi0.4Sb1.6Te3热电材料的界面性能

况志祥; 马燕; 徐晨辉; 孔栋; 冯波; 樊希安

doi:10.19976/j.cnki.43-1448/TF.2021085

粉末冶金材料科学与工程 >

2022 , Vol. 27 >Issue 1: 77 - 82

DOI: https://doi.org/10.19976/j.cnki.43-1448/TF.2021085

工艺技术

Ni/Bi_0.4Sb_1.6Te₃热电材料的界面性能

况志祥 ,
马燕 ,
徐晨辉 ,
孔栋 ,
冯波 ,
樊希安

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1.武汉科技大学省部共建耐火材料与冶金国家重点实验室,武汉 430081;
2.武汉科技大学钢铁冶金及资源利用省部共建教育部重点实验室,武汉 430081

收稿日期: 2021-10-21

修回日期: 2021-12-12

网络出版日期: 2021-12-06

基金资助

国家重点研发计划“科技助力经济2020”重点专项(SQ2020YFF0404755)

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Interface performance of Ni/Bi_0.4Sb_1.6Te₃ thermoelectric material

KUANG Zhixiang ,
MA Yan ,
XU Chenhui ,
KONG Dong ,
FENG Bo ,
FAN Xi'an

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1. The State Key Laboratory of Refractories and Metallurgy, Wuhan University of Science and Technology, Wuhan 430081, China;
2. Key Laboratory for Ferrous Metallurgy and Resources Utilization of Ministry of Education, Wuhan University of Science and Technology, Wuhan 430081, China

Received date: 2021-10-21

Revised date: 2021-12-12

Online published: 2021-12-06

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摘要

Bi_0.4Sb_1.6Te₃热电材料和金属电极之间的阻挡层是热电器件稳定服役的控制性因素,本文以不同温度下退火后的高致密Ni箔和Bi_0.4Sb_1.6Te₃合金为原料,采用放电等离子烧结扩散焊连接法在Bi_0.4Sb_1.6Te₃表面制备Ni层作为Ni/ Bi_0.4Sb_1.6Te₃电极接头的阻挡层。采用X射线衍射仪对阻挡层进行物相分析,用扫描电镜及能谱仪观察和分析电极接头的界面形貌与元素分布。结果表明,在700 ℃退火后的Ni箔具有优良的防扩散效果,扩散厚度为9 μm,用700 ℃退火后的Ni箔与Bi_0.4Sb_1.6Te₃扩散焊结合,获得13.19 MPa的结合强度。随Ni箔的退火温度升高,Ni/Bi_0.4Sb_1.6Te₃界面裂纹明显改善,这是由于随Ni箔退火温度升高,Ni与Bi_0.4Sb_1.6Te₃之间的晶格失配得到改善,从而使Ni层与Bi_0.4Sb_1.6Te₃的连接性能提高。

关键词： Ni箔; Bi_0.4Sb_1.6Te₃合金; 扩散焊; 阻挡层; 扩散层

本文引用格式

况志祥 , 马燕 , 徐晨辉 , 孔栋 , 冯波 , 樊希安 . Ni/Bi_0.4Sb_1.6Te₃热电材料的界面性能[J]. 粉末冶金材料科学与工程, 2022 , 27(1) : 77 -82 . DOI: 10.19976/j.cnki.43-1448/TF.2021085

Abstract

The barrier layer between the Bi_0.4Sb_1.6Te₃ thermoelectric material and the metal electrode is the controlling factor for the stable service of the thermoelectric device. In this paper, the spark plasma sintering diffusion welding method was used to prepare a Ni layer on the Bi_0.4Sb_1.6Te₃ surface as a barrier layer for the Ni/Bi_0.4Sb_1.6Te₃ electrode joint, in which high-density Ni foil and Bi_0.4Sb_1.6Te₃ alloy were used as the raw materials. The phase analysis of the barrier layer was performed using X-ray diffractometer. The interface morphology and element distribution of the electrode joints were analyzed by the scanning electron microscope and its energy spectrometer. The results show that the Ni foil annealed at 700 ℃ has excellent anti-diffusion effect, and the diffusion thickness is as low as 9 μm. The Ni foil annealed at 700 ℃ is combined with Bi_0.4Sb_1.6Te₃ by diffusion welding to obtain a bonding strength of 13.19 MPa. As the annealing temperature of Ni foil increases, Ni/Bi_0.4Sb_1.6Te₃ interface cracks are significantly improved. This is because the lattice mismatch between Ni/Bi_0.4Sb_1.6Te₃ can be improved with the incresing annealing temperature of Ni foil, thereby the connection performance of the Ni layer and Bi_0.4Sb_1.6Te₃ is improved.

Key words： Ni foil; Bi_0.4Sb_1.6Te₃ alloy; diffusion welding; barrier layer; diffusion layer

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