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Materials Science and Engineering of Powder Metallurgy  2024, Vol. 29 Issue (1): 45-52    DOI: 10.19976/j.cnki.43-1448/TF.2023077
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Ti plate embedding diamond particles boron-doped diamond electrode and its properties
DOU Jinjie1, LIU Dianhong2, JIANG Luan2, LI Jing2, MA Li1, WEI Qiuping1,2
1. State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, China;
2. School of Materials Science and Engineering, Central South University, Changsha 410083, China
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