退火温度对镍/铜爆炸复合板微观组织与力学性能的影响

doi:10.19976/j.cnki.43-1448/TF.2023052

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Abstract Ni/Cu laminated composite plates were fabricated by explosive welding. The effects of annealing temperature on the microstructure and mechanical properties of Ni/Cu composite plates were studied by optical microscope, scanning electron microscope, electron probe, and energy spectrometer, as well as tensile, shear, and hardness tests. The results show that with the increase of annealing temperature, the grain size of Ni and Cu matrix on both sides of the interface of the composite plate increases, and the thickness of the interface element diffusion layer increases. When the annealing temperature is 600 ℃, the thickness of the element diffusion layer reaches 5.82 μm. The hardness distribution of the composite plate after annealing at 200 ℃ has little change compared with that of the explosive state. When the annealing temperatures are 400 ℃ and 600 ℃, the hardness (HV1) at the interface are 65.1 and 66.1, respectively, which are significantly lower than that in the explosive state (160.2). The tensile strength of the composite plates in explosive state and after annealing at 200, 400, and 600 ℃ are 351.6, 305.9, 281.7, and 284.8 MPa, respectively, with elongation of 2.6%, 7.8%, 39.1%, and 39.4%.When the annealing temperature is 400 ℃, the shear strength of the composite plate reaches the maximum value of 191.3 MPa, which is 17.5 MPa higher than that of the explosive state.

Key words： Ni/Cu composite plate explosive welding annealing treatment microstructure mechanical property

Received: 06 May 2023 Published: 22 November 2023

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	CHEN Huijie
	LI Huizhong
	LIANG Xiaopeng
	LU Yuchen
	ZENG Zhiheng

Cite this article:

CHEN Huijie,LI Huizhong,LIANG Xiaopeng, et al. Effects of annealing temperature on the microstructure and mechanical properties of Ni/Cu explosive composite plates[J]. Materials Science and Engineering of Powder Metallurgy, 2023, 28(5): 465-472.

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http://pmbjb.csu.edu.cn/EN/10.19976/j.cnki.43-1448/TF.2023052 OR http://pmbjb.csu.edu.cn/EN/Y2023/V28/I5/465

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