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| Platinum paste sintering process of thick film heating element on nickel alloy substrate |
| LI Zhiqiang, LEI Ping, YOU Junheng, LI Tinghua, HAN Jingmei, LÜ Xi, WANG Hao, SHANG Shanzhai, ZHU Donglai |
| Technology Center of China Tobacco Yunnan Industrial Co., Ltd., Kunming 650231, China |
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Abstract The glass-ceramics insulating layer was prepared on the surface of GH783 alloy by print-sintering process, and then the platinum paste layer was sintered on the surface of the insulating layer to obtain the thick film heating circuit. The surface and section morphology of the resistance layer after the sintering of platinum paste were observed by SEM. The resistance of thick film heating circuit was measured by DC resistance meter. The resistance temperature coefficient of the heating circuit was measured by the resistance value and temperature characteristic test system of ceramic heating plate. The effects of sintering temperature and holding time on the microstructure and resistance value of resistance layer were studied. The optimal sintering process parameters of platinum paste were determined as follows: sintering temperature of 850 ℃, holding time of 5 min. The accuracy of resistance temperature coefficient of GH783 thick film heating element is 0.24%, and it is 4.86 s when it is heated from room temperature to 350 ℃. It shows excellent heating performance, which provides design ideas and experimental cases for the preparation of metal-based heating element.
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Received: 24 August 2021
Published: 22 December 2021
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2021, Vol. 26 
