聚酰胺酸盐法制备聚酰亚胺/绢云母复合胶黏剂的性能

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Abstract In order to obtain polyimide (PI) adhesives with stable properties, 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA), 2,2'-bis[4-(4-Aminophenoxy)phenyl]propane (BAPP) and 4,4'-diaminodiphenylmethane (MDA) ternary monomers were co-condensed into polyimide based on the addition of triethylamine (TEA) synthesize the precursor of polyamic acid salt (PAAS) and modify it with organic sericite to obtain PI/sericite composite adhesive. The adhesive was analyzed by DSC, and the bond strength and dynamic mechanical properties were also tested. The results show that compared with pure PI adhesive, the storage stability, thermal stability, bonding strength and damping performance of PI/sericite composite adhesive are significantly improved. During DSC analysis, the temperature at (T₅) 5% mass loss and the temperature at (T₁₀) 10% mass loss of composite binder (mass fraction of sericite is 30%) are 25 ℃ and 21 ℃ higher than those of PI binder, respectively, and the bonding strength is up to 20.0 MPa, 29.7% higher than that of pure PI binder.

Key words： polyamide salt polyimide sericite bonding strength composites

Received: 12 April 2021 Published: 10 November 2021

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TQ327.9

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	Articles by authors
	XIANG Yu
	LANG Feng
	WEI Mengling
	LI Duxin

Cite this article:

XIANG Yu,LANG Feng,WEI Mengling, et al. Properties of polyimide/sericite composite adhesive prepared by polyamic acid salt method[J]. Materials Science and Engineering of Powder Metallurgy, 2021, 26(5): 451-455.

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http://pmbjb.csu.edu.cn/EN/ OR http://pmbjb.csu.edu.cn/EN/Y2021/V26/I5/451

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