Composition performance design of Sn-In-Ag/Bi series low-temperature lead-free solder based on Jmatpro software
JIAO Hua1,2, BAI Jiayu1, ZHANG Jianxun3, ZHAO Kang1,2
1. School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, China; 2. Shaanxi Province Key Laboratory of Corrosion and Protection, Xi’an University of Technology, Xi’an 710048, China; 3. State Key Laboratory for Mechanical Behavior of Material, Xi’an Jiaotong University, Xi’an 710049, China
Abstract In order to solve the problems of high production cost and low mechanical properties of Sn-In lead-free solder, the low melting point Sn-In solder alloy was selected due to the phase diagram of Sn-In alloy. The composition optimization of Sn-In solder alloy was carried out to improve the thermal properties, mechanical properties and reduce cost. The low temperature lead free solder of Sn-In-Ag/Bi with different composition ratios can be formed by adding Ag and Bi elements at Sn75. The low temperature solder composition was simulated and calculated by the material phase diagram and thermodynamic simulation software of JMatPro. The Sn alloy module was selected in the software. The phase composition, thermal properties, and mechanical properties of the lead-free solder with different composition changes can be obtained. Meanwhile, the effects of temperature and alloy content on melting point, melting range, thermal properties and mechanical properties were studied. The simulation results show that two types of low-temperature lead-free solders of Sn-In-Ag and Sn-In-Ag-Bi series have the optimized compositions of Sn75Ag3In22 and Sn75In17Ag3Bi5, respectively.
JIAO Hua,BAI Jiayu,ZHANG Jianxun, et al. Composition performance design of Sn-In-Ag/Bi series low-temperature lead-free solder based on Jmatpro software[J]. Materials Science and Engineering of Powder Metallurgy, 2022, 27(3): 267-275.
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2022, Vol. 27 
