基于JMatPro的Sn-In-Ag/Bi系低温无铅钎料成分性能设计

doi:10.19976/j.cnki.43-1448/TF.2021076

Abstract
Figure/Table
References
Related Citation (6)

Download: PDF (809 KB) HTML (1 KB)
Export: BibTeX | EndNote (RIS)

Abstract In order to solve the problems of high production cost and low mechanical properties of Sn-In lead-free solder, the low melting point Sn-In solder alloy was selected due to the phase diagram of Sn-In alloy. The composition optimization of Sn-In solder alloy was carried out to improve the thermal properties, mechanical properties and reduce cost. The low temperature lead free solder of Sn-In-Ag/Bi with different composition ratios can be formed by adding Ag and Bi elements at Sn75. The low temperature solder composition was simulated and calculated by the material phase diagram and thermodynamic simulation software of JMatPro. The Sn alloy module was selected in the software. The phase composition, thermal properties, and mechanical properties of the lead-free solder with different composition changes can be obtained. Meanwhile, the effects of temperature and alloy content on melting point, melting range, thermal properties and mechanical properties were studied. The simulation results show that two types of low-temperature lead-free solders of Sn-In-Ag and Sn-In-Ag-Bi series have the optimized compositions of Sn75Ag3In22 and Sn75In17Ag3Bi5, respectively.

Key words： Sn-In lead-free solder JMatPro phase diagram thermphysical property

Received: 26 August 2021 Published: 19 July 2022

ZTFLH:

TG146.14

	Service

	E-mail this article
	Add to my bookshelf
	Add to citation manager
	E-mail Alert
	RSS
	Articles by authors
	JIAO Hua
	BAI Jiayu
	ZHANG Jianxun
	ZHAO Kang

Cite this article:

JIAO Hua,BAI Jiayu,ZHANG Jianxun, et al. Composition performance design of Sn-In-Ag/Bi series low-temperature lead-free solder based on Jmatpro software[J]. Materials Science and Engineering of Powder Metallurgy, 2022, 27(3): 267-275.

URL:

http://pmbjb.csu.edu.cn/EN/10.19976/j.cnki.43-1448/TF.2021076 OR http://pmbjb.csu.edu.cn/EN/Y2022/V27/I3/267

[1] OLAYIDE R A, RIDWAN A A, PETER O A, et al.Tensile, hardness and microstructural properties of Sn-Pb solder alloys[J]. Materials Today: Proceedings, 2021, 44(1): 321-325.
[2] WOODMANSEE M W, NEU R W.Effect of stress and strain state on heterogeneous coarsening in Sn-Pb solder[J]. Acta Materialia, 2006, 54(1): 197-207.
[3] ZHANG N X, KAWASAKI M, HUANG Y, et al.An examination of microstructural evolution in a Pb-Sn eutectic alloy processed by high-pressure torsion and subsequent self-annealing[J]. Materials Science and Engineering A, 2021, 802:140653.
[4] LIU X W, PLUMBRIDGE W J.Thermomechanical fatigue of Sn-37wt.%Pb model solder joints[J]. Materials Science and Engineering A, 2003, 362(1/2): 309-321.
[5] SHUN F C, HUANG C M, PECHT M.A review of lead-free solders for electronics applications[J]. Microelectronics Reliability, 2017, 75: 77-95.
[6] 张海坡, 阮建明. 电子封装材料及其技术发展状况[J]. 粉末冶金材料科学与工程, 2003(3): 216-223.
ZHANG Haipo, RUAN Jianming.Development of electronic packaging materials and technology[J]. Journal of Materials Science and Engineering for Powder Metallurgy, 2003(3): 216-223.
[7] 张富文, 刘静, 杨福宝, 等. 无铅电子封装焊料的研究现状与展望[J]. 材料导报, 2005(11): 47-49, 64.
ZHANG Fuwen, LIU Jing, YANG Fubao, et al.Research status and prospect of lead-free solder for electronic packaging[J]. Materials Review, 2005(11): 47-49, 64.
[8] 常玲玲, 何新波, 吴茂, 等. 微电子封装用SiC_p/Al复合材料的中温钎焊[J].粉末冶金材料科学与工程, 2010, 15(3): 219-224.
CHANG Lingling, HE Xinbo, WU Mao, et al.Middle temperature brazing of SiC_P/Al composites for microelectronics packaging[J]. Journal of Materials Science and Engineering of Powder Metallurgy, 2010, 15(3): 219-224.
[9] WISLEI R O, LEANDRO C P, LEANDRO R G, et al.Microstructure and mechanical properties of Sn-Bi, Sn-Ag and Sn-Zn lead-free solder alloys[J]. Journal of Alloys and Compounds, 2013, 572: 97-106.
[10] ChENG S F, HUANG C M, PECHT M. A review of lead-free solders for electronics applications[J]. Microelectronics Reliability, 2017, 75:77-95.
[11] MARUYA Y, HATA H, SHOHJI I, et al.Bonding characteristics of Sn-57Bi-1Ag low-temperature lead-free solder to gold-plated copper[J]. Procedia Engineering, 2017, 184, 223.
[12] HIREN R K, PHILIP D H, SAMJID H M.A review: On the development of low melting temperature Pb-free solders[J]. Microelectronics Reliability, 2014, 54: 1253-1273.
[13] 黄明亮, 任婧. 低温无铅钎料合金系研究进展[J]. 电子元件与材料, 2020, 39(10): 1-10.
HUANG Mingliang, REN Jing.Research progress of low temperature lead-free solder alloy system[J]. Electronic Components and Materials, 2020, 39(10): 1-10.
[14] LIU J C, ZHANG G, WANG Z H, et al.Thermal property, wettability and interfacial characterization of novel Sn-Zn-Bi-In alloys as low-temperature lead-free solders[J]. Materials and Design, 2015, 84: 331-339.
[15] ZHOU S Q, YANG C H, SHEN Y A, et al.The newly developed Sn-Bi-Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength[J]. Materialia, 2019, 6: 100300.
[16] EL-DALY A A, HAMMAD A E. Elastic properties and thermal behavior of Sn-Zn based lead-free solder alloys[J]. Journal of Alloys and Compounds, 2010, 505(2): 793-800.
[17] 李琴, 雷永平, 符寒光, 等. Sn-Bi-In低温无铅钎料的组织和性能[J]. 稀有金属材料与工程, 2017, 46(10): 3038-3042.
LI Qin, LEI Yongping, FU Hanguang, et al.Microstructure and properties of Sn-Bi-In lead-free solder at low temperature[J]. Rare Metal Materials and Engineering, 2017, 46(10): 3038-3042.
[18] 李威, 李萌蘖, 卜恒勇. Sn-Bi-In合金焊料及相图计算基础[J]. 稀有金属, 2020, 44(2): 195-204.
LI Wei, LI Mengnie, BU Hengyong.Calculation of phase diagram of Sn-Bi-In alloy solder[J]. Rare Metals, 2020, 44(2): 195-204.
[19] MANASIJEVIĆ D, BALANOVI Ć L, MARKOVI Ć I, et al.Microstructure, melting behavior and thermal conductivity of the Sn-Zn alloys[J]. Thermochimica Acta, 2021, 702: 178978.
[20] SHALABY R M.Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi-Sn based lead-free solder alloys[J]. Materials Science and Engineering A, 2013, 560: 86-95.
[21] ÖZTÜRK E, AKSÖZ S, KESLIOGLU K, et al. The measurement of thermal conductivity variation with temperature for Sn-20wt.% In based lead-free ternary solders[J]. Thermochimica Acta, 2013, 554: 63-70.
[22] LI C J, YAN Y F, GAO T T, et al.The influence of Ag on the microstructure, thermal properties and mechanical behavior of Sn-25Sb-xAg high temperature lead-free solder[J]. Vacuum, 2021, 185: 110015.
[23] SAYYADI R, MOOSAVY H N.Physical and mechanical properties of synthesized low Ag/lead-free Sn-Ag-Cu-xBi (x=0, 1, 2.5, 5wt%) solders[J]. Materials Science and Engineering A, 2018, 735(26): 367-377.
[24] RAI A K, TRPATHY H, HAJRA R N, et al.Thermophysical properties of Ni based super alloy 617[J]. Journal of Alloys and Compounds, 2017, 698: 442-449.
[25] DAI S J, WANG Y, CHEN F, et al.Design of new biomedical titanium alloy based on d-electron alloy design theory and JMatPro software[J]. Transactions of Nonferrous Metals Society of China, 2013, 23(10): 3027.
[26] PARK J, LEE S B, KANG S G, et al.Complex effects of alloy composition and porosity on the phase transformations and mechanical properties of powder metallurgy steels[J]. Powder Technology, 2015, 284: 459-466.
[27] 杨永春. 基于JMatPro软件15CrMo渗碳钢淬火组织与热物理力学性能预测[J]. 热加工工艺, 2013, 42(20): 184-187.
YANG Yongchun.Prediction of quenched microstructure and thermal physical and mechanical properties of 15CrMo carburized steel based on JMatPro software[J]. Hot Working Technology, 2013, 42(20):184-187.