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Materials Science and Engineering of Powder Metallurgy >

2022 , Vol. 27 >Issue 1: 77 - 82

DOI: https://doi.org/10.19976/j.cnki.43-1448/TF.2021085

Engineering and Technology

Interface performance of Ni/Bi0.4Sb1.6Te3 thermoelectric material

  • KUANG Zhixiang ,
  • MA Yan ,
  • XU Chenhui ,
  • KONG Dong ,
  • FENG Bo ,
  • FAN Xi'an
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  • 1. The State Key Laboratory of Refractories and Metallurgy, Wuhan University of Science and Technology, Wuhan 430081, China;
    2. Key Laboratory for Ferrous Metallurgy and Resources Utilization of Ministry of Education, Wuhan University of Science and Technology, Wuhan 430081, China

Received date: 2021-10-21

  Revised date: 2021-12-12

  Online published: 2021-12-06

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Abstract

The barrier layer between the Bi0.4Sb1.6Te3 thermoelectric material and the metal electrode is the controlling factor for the stable service of the thermoelectric device. In this paper, the spark plasma sintering diffusion welding method was used to prepare a Ni layer on the Bi0.4Sb1.6Te3 surface as a barrier layer for the Ni/Bi0.4Sb1.6Te3 electrode joint, in which high-density Ni foil and Bi0.4Sb1.6Te3 alloy were used as the raw materials. The phase analysis of the barrier layer was performed using X-ray diffractometer. The interface morphology and element distribution of the electrode joints were analyzed by the scanning electron microscope and its energy spectrometer. The results show that the Ni foil annealed at 700 ℃ has excellent anti-diffusion effect, and the diffusion thickness is as low as 9 μm. The Ni foil annealed at 700 ℃ is combined with Bi0.4Sb1.6Te3 by diffusion welding to obtain a bonding strength of 13.19 MPa. As the annealing temperature of Ni foil increases, Ni/Bi0.4Sb1.6Te3 interface cracks are significantly improved. This is because the lattice mismatch between Ni/Bi0.4Sb1.6Te3 can be improved with the incresing annealing temperature of Ni foil, thereby the connection performance of the Ni layer and Bi0.4Sb1.6Te3 is improved.

Key words： Ni foil; Bi0.4Sb1.6Te3 alloy; diffusion welding; barrier layer; diffusion layer

Cite this article

KUANG Zhixiang , MA Yan , XU Chenhui , KONG Dong , FENG Bo , FAN Xi'an . Interface performance of Ni/Bi0.4Sb1.6Te3 thermoelectric material[J]. Materials Science and Engineering of Powder Metallurgy, 2022 , 27(1) : 77 -82 . DOI: 10.19976/j.cnki.43-1448/TF.2021085

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